POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD OF FORMING PATTERN, AND ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide a positive photosensitive resin composition that is developed with an aqueous alkali solution and enables a pattern which is excellent in heat resistance and mechanical characteristics, while having a good shape, and to provide a method of forming a pattern and electronic components.

SOLUTION: The positive photosensitive resin composition contains (a) a polyimide-based polymer having a structural unit represented by general formula (1) and a structural unit represented by a specific structure, (b) a compound generating an acid when irradiated with an actinic ray, and (c) a compound which is crosslinkable or polymerizable with the component (a) by heat, wherein the component (c) is contained in an amount of ≥20 pts.wt. based on 100 pts.wt. of the component (a).

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