| 摘要 |
PROBLEM TO BE SOLVED: To provide a load port particularly well-suited to application in batch processing semiconductor manufacturing processes. SOLUTION: The load port 1 includes a load port body 2 having a main table 27 onto which a FOUP (Front-Opening Unified Pod) 4 containing wafers is placed, a mapping means 24 for mapping the wafers contained within the FOUP 4, and the like, and is further provided with a displacing means 3 for moving the FOUP 4 between the main table 27 and a predetermined position removed a distance from the load port body 2, in which the displacing mechanism 3 is provided with an open space 34 enabling the passing of the FOUP 4 which contains wafers between the predetermined position and a piece of other equipment located adjacent to the load port body 2. COPYRIGHT: (C)2009,JPO&INPIT
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