发明名称 Polishing end point detection method, polishing end point detection apparatus and polishing apparatus
摘要 A polishing end point detection method is to detect a polishing end point of a workpiece having a multilayer structure. The method is performed by emitting a first light and a second light to a surface of the workpiece at a first angle of incidence and a second angle of incidence, respectively, receiving the first light and the second light reflected from the surface through a polarizing filter, performing a first analyzing process of analyzing a brightness and a saturation of the surface from the first light received, performing a second analyzing process of analyzing a brightness and a saturation of the surface from the second light received, and determining removal of the upper layer based on changes in the brightness and the saturation of the surface.
申请公布号 US2009153859(A1) 申请公布日期 2009.06.18
申请号 US20080314839 申请日期 2008.12.17
申请人 KIMBA TOSHIFUMI 发明人 KIMBA TOSHIFUMI
分类号 G01J4/00 主分类号 G01J4/00
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