| 摘要 |
The present invention relates to a LED module with a reduced operating temperature. The LED module includes a substrate, a plurality of LED chips, a carrier and an encapsulant layer. These LED chips are disposed on the substrate and electrically connected to the substrate and are divided into a first LED chip set and a second LED chip set. The carrier is coupled to the substrate and has a driving circuit. The driving circuit is electrically connected to the plurality of LED chips for driving operations of the plurality of LED chips. The first LED chip set and the second LED chip set emit light in an alternate lighting manner or in a combined simultaneous/alternate lighting manner so as to reduce the operating temperature of the LED module. The encapsulant layer covers the plurality of LED chips, the substrate and the carrier having the driving circuit.
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