发明名称 |
INTERCONNECT STRUCTURE AND METHOD OF MAKING SAME |
摘要 |
An interconnect structure and method of fabricating the same is provided. More specifically, the interconnect structure is a defect free capped interconnect structure. The structure includes a conductive material formed in a trench of a planarized dielectric layer which is devoid of cap material. The structure further includes the cap material formed on the conductive material to prevent migration. The method of forming a structure includes selectively depositing a sacrificial material over a dielectric material and providing a metal capping layer over a conductive layer within a trench of the dielectric material. The method further includes removing the sacrificial material with any unwanted deposited or nucleated metal capping layer thereon.
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申请公布号 |
US2009152723(A1) |
申请公布日期 |
2009.06.18 |
申请号 |
US20070954812 |
申请日期 |
2007.12.12 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
OU YA;PONOTH SHOM;SPOONER TERRY A. |
分类号 |
H01L23/532;H01L21/4763 |
主分类号 |
H01L23/532 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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