发明名称 Polishing Composition and Polishing Method Using The Same
摘要 A polishing composition includes an abrasive, at least one compound of azoles and derivatives thereof, and water. The polishing composition is used in applications for polishing surfaces of semiconductor substrates in a suitable manner.
申请公布号 US2009156008(A1) 申请公布日期 2009.06.18
申请号 US20090371840 申请日期 2009.02.16
申请人 FUJIMI INCORPORATED 发明人 SAKAMOTO KENJI
分类号 H01L21/304;B24B37/00;C09G1/02;C09K3/14;C09K13/00;H01L21/306 主分类号 H01L21/304
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