发明名称 |
FILM-SHAPED CIRCUIT CONNECTION MATERIAL, CIRCUIT MEMBER CONNECTION STRUCTURE, AND MANUFACTURING METHOD THEREOF |
摘要 |
A circuit member connection structure (10) includes circuit members (20, 30) having a plurality of circuit electrodes (22, 32) formed on main surfaces (21a, 31a) of circuit substrates (21, 31). A circuit connection member (60) connects the circuit members (30, 30) to each other so that the circuit electrodes (22, 32) oppose. The circuit connection member (60) is made of a hardening material for hardening the circuit connection material. The circuit connection material contains an adhesive component and coated particles (50) made of conductive particles (51) each having a part of the surface (51a) coated by insulating fine particles (52). The insulating fine particle (52) has a mass equal to 2/1000 to 26/1000 of the mass of the conductive particle (51). |
申请公布号 |
KR20090064461(A) |
申请公布日期 |
2009.06.18 |
申请号 |
KR20097008205 |
申请日期 |
2005.01.06 |
申请人 |
HITACHI CHEMICAL COMPANY, LTD. |
发明人 |
TAKETATSU JUN;WATANABE ITSUO;GOTOU YASUSHI;YAMAGUCHI KAZUO;FUJII MASAKI;FUJII AYA |
分类号 |
H01B17/66;H01B3/00;H01R4/04;H01R11/01;H01R43/00;H05K3/32;H05K3/36 |
主分类号 |
H01B17/66 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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