发明名称 |
Wafer edge grinding apparatus using a grinding wheel truing tool and manufacturing method thereof, and method for manufacturing a grinding wheel |
摘要 |
<p>The present invention relates to a grinding wheel truing tool, its manufacturing method, and a truing apparatus, a method for manufacturing a grinding wheel and a wafer edge grinding apparatus using the same. The grinding wheel truing tool of the present invention compensates a groove of a fine-grinding wheel for fine-grinding a wafer edge, and includes a truer having an edge of the same angle as a slanted surface of the groove of the fine-grinding wheel and a cross-sectional shape corresponding to a cross-sectional shape of the groove. The present invention uses the truing tool to easily process the groove of the grinding wheel for fine-grinding the wafer edge.</p> |
申请公布号 |
EP2070652(A2) |
申请公布日期 |
2009.06.17 |
申请号 |
EP20080021666 |
申请日期 |
2008.12.12 |
申请人 |
SILTRON INC. |
发明人 |
KIM, YONG-DUG;CHO, GYE-JE;YONG, MUN-SUK;JUNG, HWAN-YUN;LEE, KYUNG-MOO;HYUN, DONG-HWAN;KIM, JAE-YOUNG |
分类号 |
B24B53/07;B24B9/06;B24D18/00 |
主分类号 |
B24B53/07 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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