发明名称 Wafer edge grinding apparatus using a grinding wheel truing tool and manufacturing method thereof, and method for manufacturing a grinding wheel
摘要 <p>The present invention relates to a grinding wheel truing tool, its manufacturing method, and a truing apparatus, a method for manufacturing a grinding wheel and a wafer edge grinding apparatus using the same. The grinding wheel truing tool of the present invention compensates a groove of a fine-grinding wheel for fine-grinding a wafer edge, and includes a truer having an edge of the same angle as a slanted surface of the groove of the fine-grinding wheel and a cross-sectional shape corresponding to a cross-sectional shape of the groove. The present invention uses the truing tool to easily process the groove of the grinding wheel for fine-grinding the wafer edge.</p>
申请公布号 EP2070652(A2) 申请公布日期 2009.06.17
申请号 EP20080021666 申请日期 2008.12.12
申请人 SILTRON INC. 发明人 KIM, YONG-DUG;CHO, GYE-JE;YONG, MUN-SUK;JUNG, HWAN-YUN;LEE, KYUNG-MOO;HYUN, DONG-HWAN;KIM, JAE-YOUNG
分类号 B24B53/07;B24B9/06;B24D18/00 主分类号 B24B53/07
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