| 摘要 |
A substrate polishing device is provided to reduce a contact area of a polish block and an out guide by protruding the contact surface to the outside. A polishing pad(111) is formed in a surface of a plate(110). A first driving unit is formed in one side of the plate to rotate the plate at a regular speed. A polishing head(120) is contacted with the upper part of a polishing block(130) to pressure the polishing block. The polishing block is arranged on the polishing pad to fix the substrate. The polishing block and the substrate are rotated by the rotation of the polishing head. A driving unit is formed in one side of the polishing head. A center guide(140) and an out guide(150) are formed on the table.
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