An etching method of nickel and nickel alloy is provided to improve adhesion with dielectric materials for reducing stress at interface between nickel or nickel alloy and dielectric materials. An etching method of nickel and nickel alloy comprises (a) providing a composition containing one or more inorganic acids and one or more heterocyclic nitrogeneous compounds; (b) etching nickel or a nickel alloy layer by applying the composition to the nickel or a nickel alloy layer; and (c) further anodic etching nickel or nickel alloy. The heterocyclic nitrogen compound is selected from thiazoles and mercaptans. The mercaptans is selected from mercaptotriazoles and mercaptotetrazoles.
