| 摘要 |
PURPOSE:To enable a circuit pattern to be formed suitably in accordance with the purposes directly into an IC-loaded print circuit board, by loading an IC chip on a required position of a metal foil, and perform resin-sealing. CONSTITUTION:The unclad part 1d serving as the IC-loading part is formed by etching a metal foil 1c e.g. with etching resist. A part of the metal foil 1c faces the unclad part 1d and becomes leads 1e.... A chip 2 mounted on the IC-chip- loading part thus formed is directly connected to the metal foil leads 1e with wires 3 and bonded. This IC-chip-loading part is sealed with a resin 4. |
