发明名称 |
ATTACHMENT OF AN ELECTRICAL ELEMENT TO AN ELECTRONIC DEVICE USING A CONDUCTIVE MATERIAL |
摘要 |
<p>An electrical element can be attached and electrically connected to a substrate by a conductive adhesive material. The conductive adhesive material can electrically connect the electrical element to a terminal or other electrical conductor on the substrate. The conductive adhesive material can be cured by directing a flow of heated gas onto the material or by heating the material through a support structure on which the substrate is located. A non-conductive adhesive material can attach the electrical element to the substrate with a greater adhesive strength than the conductive adhesive. The non-conductive adhesive material can also be cured by directing a flow of heated gas onto the material or by heating the material through the support structure on which the substrate is located. The non-conductive adhesive material can cover the conductive adhesive material.</p> |
申请公布号 |
EP2069807(A2) |
申请公布日期 |
2009.06.17 |
申请号 |
EP20070842828 |
申请日期 |
2007.09.20 |
申请人 |
FORMFACTOR, INC. |
发明人 |
KIM, TAE, MA |
分类号 |
G01R1/073;G01R1/067;G01R3/00 |
主分类号 |
G01R1/073 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|