| 摘要 |
An electronic parts package and a manufacturing method thereof are provided to form a filler with a predetermined shape adjacent to an inner sidewall of a cavity and a side of a light emitting device by dispensing a liquid material of a white resin component around the light emitting device. A cavity is formed in a substrate(30). An LED chip(34) is mounted in a light emitting device mounting region inside the cavity of the substrate. The LED chip is electrically connected with the pattern electrode through a wire(36). A filler(38) made of the white resin is filled in a side of a die(32) of the lower of an LED chip and an inner sidewall of the cavity. The die serves as a support for fixing the LED chip in the light emitting device mounting region. The LED chip has the wavelength band of 200 to 900 nm. |
