发明名称 COMPONENT MOUNTING METHOD AND DEVICE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a component mounting method and device, which can improve the accuracy of mounting position in a component mounting to a substrate having a component mounting region at its edge. <P>SOLUTION: The component mounting method includes: a substrate recognition step of disposing the edge of the substrate whose reverse surface held by a substrate holding device, on or above an edge supporting base, of positioning the top surface of the edge having been disposed on or above the edge supporting base at a component mounting height position, and of recognizing a mark for component mounting position confirmation provided on the top surface of the edge; a component recognition step of positioning the reverse surface of the component held by a mounting head at the component mounting height position, and of recognizing the component; and a mounting step of positioning the top surface of the edge and the reverse surface of the component at the component mounting position and of mounting the component at a component mounting position of the edge based upon a result of the recognition. <P>COPYRIGHT: (C)2009,JPO&INPIT</p>
申请公布号 JP2009088158(A) 申请公布日期 2009.04.23
申请号 JP20070254633 申请日期 2007.09.28
申请人 PANASONIC CORP 发明人 MAEDA TAKESHI;HAMADA RYUJI
分类号 H01L21/60 主分类号 H01L21/60
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