| 摘要 |
PROBLEM TO BE SOLVED: To provide a bonding device capable of uniformly heating an electronic component by providing a uniformization means for uniformizing an energy distribution of a laser which is let out from a light-guide means, whereby a bonding device is provided which has an excellent energy efficiency and is free from the occurrence of faults such as a damage of a substrate etc. SOLUTION: A first bonding device has a bonding head 4 with a bonding tool 3 which sucks and holds an electronic component 1 on the tool tip, a laser oscillator 14, and a light-guide means 9 for guiding a laser beam emitted from the laser oscillator to the bonding tool 3, in which the electronic component 1 is irradiated and heated with the laser beam through the bonding tool 3 when bonding is made. A second bonding device includes a uniformization means 12 adapted for uniformizing an energy distribution of the laser beam which is let out from the light-guide means 9. COPYRIGHT: (C)2009,JPO&INPIT
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