| 摘要 |
PROBLEM TO BE SOLVED: To provide a high frequency module in which an increase in cost is avoided and which can be made compact. SOLUTION: In the high frequency module 10 provided with a substrate 11 with an electronic parts 12 mounted and a metal case 13 mounted on the substrate 11 to cover the electronic parts 12, the metal case 13 has a leg part 14 formed higher than the electronic parts 12 by bending a portion of the metal case 13 and a contact part 15 jointed to a land 11a formed on the surface of the substrate 11 by soldering by bending a front end of the leg part 14, wherein the area of the contact part 15 is narrower than the area of the land 11a. COPYRIGHT: (C)2009,JPO&INPIT
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