RESIN COMPOSITION, RESIN FILM, AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a resin composition that can give a resin film having a low dielectric constant and excellent mechanical strength, and to provide a resin film and a semiconductor device having the resin film having a low dielectric constant and excellent heat resistance and mechanical characteristics. SOLUTION: The resin composition to be used for forming a resin film contains a compound having a cage structure. The compound having a cage structure is characterized in that when a film made of the compound having the cage structure is measured by a positron annihilation life measurement method, the first peak top of the positron annihilation lifetime corresponding to the pore size obtained by the measurement method is in a region not less than 10 ns. The resin film comprises a cured product of the above described resin composition. The semiconductor device has the above described resin film. COPYRIGHT: (C)2009,JPO&INPIT