| 摘要 |
A die pick-up apparatus and method using a wiper that has a tip end moving in and out of an adherence surface of a die stage and a shutter that is moved with the wiper while blocking a suction window formed in the adherence surface. When picking up a semiconductor die, the tip end of the wiper is aligned with a first end of the die, the wiper is moved along the adherence surface while the tip end of the wiper is protruded from the adherence surface with the die being suction-held by a collet. A suction opening is sequentially opened between a first end surface of the suction window and a seat surface of the wiper as the wiper is moved, and a dicing sheet attached to the die is suctioned into the suction opening that has been opened and sequentially peeled off from the die.
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