| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an element mounting substrate with high heat dissipation property, and to provide a semiconductor module having the same. <P>SOLUTION: In the element mounting substrate 10, an insulating layer 12 contains a filler which is formed of an insulating resin and has higher heat conductivity than that of the resin. An electrode 14 is provided in the insulating layer 12. An exposed portion 16a is exposed on the surface of the insulating layer 12 on the same side as the side where the electrode 14 is exposed. Consequently, when a semiconductor element is mounted on the element mounting substrate 10 and a terminal of the semiconductor element is connected to the electrode 14, the exposed portion 16a comes in contact with the semiconductor element with higher possibility, so the heat dissipation is more enhanced. <P>COPYRIGHT: (C)2009,JPO&INPIT |
