| 摘要 |
PROBLEM TO BE SOLVED: To surely prevent the occurrence of displacement due to pressure bonding, when mounting an electronic component through pressure bonding. SOLUTION: Each of wall-like guide members 40 for holding the position of a drive IC 4, after positioning during pressurization, is formed between partial connecting terminals 39 in the connecting terminals 39 of a protruding part 12αto be connected with bump electrodes 4a of the drive IC 4. The guide member 40 is formed so that the upper end of the guide member 40 faces the side face of each bump electrode 4a, when the bump electrodes 4a and the connecting terminals 39 are bonded by an adhesive material. After positioning the drive IC 4, if the position of the drive IC 4 is displaced with respect to each connecting terminal 39 along with pressurization, each bump electrode 4a is brought into contact with the guide member 40 so as to restrict the movement of each bump electrode 4a by the guide member 40, thereby displacement of the drive IC 4 due to pressure bonding is suppressed. COPYRIGHT: (C)2009,JPO&INPIT |
