| 摘要 |
PROBLEM TO BE SOLVED: To provide an etching liquid that can improve surface roughness of a silicon wafer after etching and to provide a method for manufacturing a silicon wafer using the etching liquid. SOLUTION: An alkali etching liquid used for the manufacturing process of a silicon wafer contains, as a texture reducing agent on the surface of the silicon wafer, at least one kind of metal ion selected from Fe, Cu, Ni, Co and Mg, at the concentration of the metal ion ranging from 10 to 200 ppb. The alkali concentration of the alkali etching liquid ranges from 30 to 70 wt.%. After a silicon wafer is etched by using the etching liquid, the silicon wafer is cleaned. COPYRIGHT: (C)2009,JPO&INPIT
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