| 摘要 |
In order not to transmit an impact when grinding is started, or micro-vibrations of a grinding wheel during grinding to a wafer, a grinding apparatus at least includes: a chuck table that holds a wafer; a grinding unit having a grinding wheel configured to include a grinding wheel part that is fixed to a wheel base and grinds a wafer held on the chuck table and having a wheel mount that supports the wheel base; and a grinding unit feeding unit that brings the grinding unit dose to and away from the chuck table, wherein a vibration damping rubber having a rebound resilience of 2% to 4% standardized by ISO 4662 is provided between the wheel base and the wheel mount, whereby an impact when grinding is started, or micro-vibrations of a grinding wheel during grinding are absorbed.
|
