MANUFACTURING METHOD OF RELEASE FILMS AND RELEASE FILMS

摘要

Disclosed is a manufacturing method of release films and the release films. The method includes a first step of fabricating a multi-layer film by laminating 80 weight% to 99 weight% of polypropylene (PP) and 1 weight% to 20 weight% of polydimethylsiloxane resin through co- extrusion. A cost of the release film is lowered by laminating low-priced polypropylene and polydimethylsiloxane with a predetermined weight ratio to fabricate the release film. The manufacturing cost of the release film is reduced while representing the same effect as that of a conventional release film by performing corona treatment for the release film. The polyimide is coated on the copper plate using the release film having a semi cross-linked surface when the high temperature occurs in a PCB process. Work efficiency is raised by employing a buffer film.