发明名称 GLASS CAP MOLDING PACKAGE, METHOD FOR MANUFACTURING THEREOF, AND CAMERA MODULE
摘要 <P>PROBLEM TO BE SOLVED: To manufacture a module of which the size is small compared with conventional one, and to improve productivity, while reducing manufacturing cost by simplifying process. <P>SOLUTION: A glass cap molding package includes a substrate in the upper face outer block portion of which an external coupling terminal is provided, an image sensor mounted in the upper face of the substrate, a transparent member provided in the upper portion of the image sensor, and a molding portion which is provided so as to seal the image sensor and the transparent member, and exposes the external coupling terminal of the substrate to the side of the substrate. A method for manufacturing thereof and a camera module are provided. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009088510(A) 申请公布日期 2009.04.23
申请号 JP20080241770 申请日期 2008.09.19
申请人 SAMSUNG ELECTRO MECH CO LTD 发明人 RYU JIN MUN;LEE JUNG SEOK;PARK HYUNG KYU;KIM BO KYOUNG;WOO YUN SEOK;KIM JUNG JIN
分类号 H01L27/14;H01L23/02;H01L23/28;H04N5/335 主分类号 H01L27/14
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