发明名称 MULTILAYER PRINTED CIRCUIT BOARD AND ITS MANUFACTURING METHOD
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a multilayer printed circuit board with electronic components mounted thereon and protected from surge, adaptable for high-density mounting of the electronic components and less liable to surge protecting function deterioration in long-period use, and to provide its manufacturing method for easily manufacturing the multilayer printed circuit board. <P>SOLUTION: The multilayer printed circuit board 1 comprises a varistor layer 2 formed of a zinc oxide sheet on the inner layer, the varistor layer 2 being connected to a signal line 3, a gland layer 4 and a power supply layer 5. <P>COPYRIGHT: (C)2009,JPO&INPIT</p>
申请公布号 JP2009088342(A) 申请公布日期 2009.04.23
申请号 JP20070257628 申请日期 2007.10.01
申请人 AICA KOGYO CO LTD 发明人 TANAKA AKIHIRO
分类号 H05K3/46 主分类号 H05K3/46
代理机构 代理人
主权项
地址