| 摘要 |
PROBLEM TO BE SOLVED: To provide a solid-state image sensing device capable of disallowing a light transparent substrate from sliding when stuck on a solid-state image sensing element using an adhesive while employing a direct sticking structure such that the light transparent substrate and a semiconductor substrate are directly stuck together with a light transparent adhesive. SOLUTION: The solid-state image sensing element 1 includes an effective pixel section (17) in a central area of a light receiving surface thereof, and ridge-shaped protruding portions 16 and 16 around the effective pixel section (17). The liquid transparent adhesive (14) is applied on the effective pixel section (17), and the light transparent substrate (3) is placed thereon. The light transparent substrate (3) comes into contact with the protruding portions (16), and is therefore prevented from sliding with the liquid adhesive (14) serving as a lubricant. Thus, the light transparent substrate (3) can be fixed at a predetermined position. COPYRIGHT: (C)2009,JPO&INPIT |
