| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor module which even after undergoing a repetitive cold cycle, still has high bonding reliability of a first solder layer bonding a circuit-side metal plate and a semiconductor element together and a second solder layer bonding a heat-dissipation-side metal plate and a heat dissipation base plate together. SOLUTION: The semiconductor module 9 is constituted by bonding the circuit-side metal plate 3 to one surface of a ceramic substrate 4 and the heat-dissipation-side metal plate 5 to the other surface, bonding the semiconductor element 1 to the circuit-side metal plate 3 through the first solder layer 2, and bonding the heat dissipation base plate 7 to the heat-dissipation-side metal plate 5 through a second solder layer 6, wherein the ratio t3/t1 of the thickness t1 of the circuit-side metal plate to the thickness t3 of the ceramic substrate is≥0.6, the ratio t3/t2 of the thickness t2 of the heat-dissipation-side metal plate to the thickness t3 of the ceramic substrate is≤2, and the ratio of the diagonal length L of a circuit board and the thickness t2 of the heat-dissipation-side metal plate is≤390. COPYRIGHT: (C)2009,JPO&INPIT |
