| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive which is used when electronic components are joined to each other, exhibits excellent thermal conductivity and/or electrical conductivity and has excellent applying property when applied to the object such as the electronic component to be stuck. SOLUTION: The adhesive contains 100 parts volume resin component, 0.1-20 parts volume high thermally-conductive fibrous filler and 10-200 parts volume high thermally-conductive spherical filler. COPYRIGHT: (C)2009,JPO&INPIT |
