| 摘要 |
PROBLEM TO BE SOLVED: To provide a sheet-like glass substrate prepreg capable of lowering water absorption without spoiling insulation reliability and heat resistance required for a printed wiring board, to provide a layered plate and to provide the printed wiring board. SOLUTION: In the sheet-like glass substrate prepreg formed by impregnating or coating a thermosetting resin (B) in or on a sheet-like glass substrate (A) and drying the resin, an area ratio [R<SB>s</SB>=Sg/2S] is in a range of 0.5 to 1.3, when the sum total area of a glass surface of the sheet-like glass substrate (A) and a sheet area are defined as Sg and S, respectively. The layered plate and the printed wiring board using the same are also provided. COPYRIGHT: (C)2009,JPO&INPIT
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