| 摘要 |
PROBLEM TO BE SOLVED: To provide a measuring instrument enhancing the work efficiency of measurement related to the height of BGA solder balls disposed in rows. SOLUTION: This height-measuring instrument 1 for BGA solder balls is equipped with light-projecting means 14, 15, 16, and 17 for applying light L1 to the solder balls 31 disposed in rows; a linear image sensor 19, having a light-receiving surface comprising a plurality of pixels to receive reflected light L2 from the solder balls with light applied thereto at positions on the receiving surface corresponding, to distances from the solder balls and generating light reception signals S1 corresponding to the light-receiving positions; and a measurement means 41 for measuring the displacement of the solder balls in height, based on the reception signals. The light L1 from the projection means has a spot LS which is widened, in a direction orthogonal to the direction of the rows, while being in the width direction of the image sensor so that solder balls displaced from the rows can be measured. COPYRIGHT: (C)2009,JPO&INPIT
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