| 摘要 |
Package for an integrated circuit (IC), includes a housing (3) of a first material having two major surfaces (4, 5). The major surfaces are substantially parallel to each other. Furthermore, a lead frame (6) is present for carrying the IC (2), the lead frame (6) including contact terminals (7) for electrical communication with the IC (2). The package (1) has a through-hole (8) in the two major surfaces (4, 5), allowing various special applications of the package (1).
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