| 摘要 |
A silicon-controlled rectifier with a heat-dissipating structure has a heat sink, a silicon-controlled rectifying assembly, an outer contact assembly, a gate-contact assembly and a clamp. The heat sink is electrically and thermally conductive and has an inner contact surface and multiple fastener holes being formed in the flat surface around the inner contact surface. The silicon-controlled rectifying assembly is mounted on the inner contact surface and has a silicon-controlled rectifying device having a gate. The outer contact assembly is mounted on the silicon-controlled rectifying device. The gate-contact assembly is mounted against the gate of the silicon-controlled rectifying device. The clamp is mounted on the outer contact assembly and screwed to the fastener holes around the inner contact surface of the heat sink, connects to the heat sink and holds the outer contact assembly and the silicon-controlled rectifying assembly.
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