CIRCUIT CONNECTING ADHESIVE FILM AND CIRCUIT CONNECTING STRUCTURE
摘要
<p>Provided is a circuit connecting adhesive film which contains an insulating adhesive, conductive particles and a granular nonconductive phase containing polyamide elastomer and/or polyester elastomer. In the insulating adhesive, the conductive particles and the nonconductive phase are dispersed.</p>
申请公布号
WO2009051043(A1)
申请公布日期
2009.04.23
申请号
WO2008JP68263
申请日期
2008.10.08
申请人
HITACHI CHEMICAL COMPANY, LTD.;TATSUZAWA, TAKASHI;KOBAYASHI, KOUJI;ITO, AKIHIRO;YOKOZUMI, TOMOMI
