| 摘要 |
PROBLEM TO BE SOLVED: To provide a push-back type mounting substrate prepared by provisionally fixing, using a push-back technique, a first substrate for mounting electronic components thereon and a second substrate which is to be discarded in which reduction of a thickness of the substrate and improvement of mounting properties of electronic components are realized. SOLUTION: A circular-shaped first substrate 1 having a land part for mounting electronic components thereon is provisionally fixed to a second substrate 2 by a push-back system, and both substrates are adhered and fixed with an adhesive sheet 6. As a result, the rigidity of the substrates is enhanced, and at the same time, the first substrate and the second substrate are prevented from warping, whereby the electronic components are mounted stably and reduction in the thickness of the push-back type mounting substrate is realized. COPYRIGHT: (C)2009,JPO&INPIT
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