摘要 |
In a method for fixing an electronic component (3) on a printed circuit board (2), and contact-connecting the electronic component (3) to the printed circuit board (2), the following steps are provided: -providing the printed circuit board (2) having a plurality of contact and connection pads (8), -providing the electronic component (3) having a number of contact and connection locations (5) corresponding to the plurality of contact and connection pads (8) of the printed circuit board (2), with a mutual spacing reduced in comparison with the spacing of the contact and connection pads (8) of the printed circuit board (2), and -arranging or forming at least one interlayer (4) for routing the contact and connection locations (5) of the electronic component (3) between the contact and connection pads (8) of the printed circuit board (2) and the contact and connection locations (5) of the electronic component (3). A method for producing an interlayer (4) for routing and a system having a printed circuit board (2) and an electronic component (3) using the interlayer (4) for routing are also provided.
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