| 摘要 |
<p>Provided is a film forming apparatus which performs film forming process by supplying, in a vacuum atmosphere, a substrate with a processing gas from a processing gas supplying section, which faces a placing table, while heating the placing surface of the placing table. The film forming apparatus is provided with a lifting mechanism for lifting the placing table to a processing position where film forming process is to be performed to the substrate; a surrounding section, which surrounds the placing table by having a gap in between when the placing table is at the processing position, and partitions the vacuum container inside into an upper space above the placing table and a lower space below the placing table, with the placing table; a vacuum exhaust path, which communicates with the upper space and evacuates the processing atmosphere in the upper space; a heating means for heating a portion where a gas is brought into contact with, from the upper space to the vacuum exhaust path, to a temperature higher than a temperature at which a reactant adheres; and a heat insulating section arranged between the heating means and a lower side portion of the vacuum container surrounding the lower space.</p> |
