发明名称 PHOTOSENSITIVE RESIN COMPOSITION, AND PHOTOSENSITIVE ELEMENT, RESIST PATTERN FORMING METHOD, AND METHOD FOR PRODUCING PRINTED WIRING BOARD USING THE COMPOSITION
摘要 <P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition capable of ensuring adequate sensitivity and resolution in drawing with light of 350-410 nm wavelength. <P>SOLUTION: The photosensitive resin composition includes (A) a binder polymer, (B) a photopolymerizable compound having an ethylenically unsaturated bond, and (C1) a pyrazoline compound represented by a general formula (1). <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009058537(A) 申请公布日期 2009.03.19
申请号 JP20070223040 申请日期 2007.08.29
申请人 HITACHI CHEM CO LTD 发明人 MIYASAKA MASAHIRO;MURAMATSU YUKIKO
分类号 G03F7/031;G03F7/004;H05K3/00 主分类号 G03F7/031
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