| 摘要 |
PROBLEM TO BE SOLVED: To attach a heat sink plate and a ground plate to a printed substrate without exerting undue force to the heat sink plate and the printed substrate and without requiring an additional extra component. SOLUTION: In the attachment structure for attaching the heat sink plate 30 to the printed substrate 20 which is installed in a mechanical chassis 10, the chassis includes a positioning pin 11 for positioning the printed substrate, and the heat sink plate includes a guide groove 34g that engages with the positioning pin and is slidably guided in a prescribed path, a fixing portion 37 to the printed substrate, and engaging pawls 32, 33 and 35 that engage with side portions 22 and 23 of the printed substrate. By causing the heat sink plate to slide along a substrate side of the printed substrate with the guide groove being engaged with the positioning pin, the guide groove is guided by the positioning pin, whereby the engaging pawls engage with the side portions of the printed substrate. In the engagement state, by fixing the fixing portion of the heat sink plate to the printed substrate, the heat sink plate is attached to the printed substrate. COPYRIGHT: (C)2009,JPO&INPIT
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