| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate treating device capable of easily and speedily separating a substrate from a support plate without breaking the substrate. SOLUTION: The substrate treating device 10 includes a gas supply means 11 and a substrate holding means 12. The gas supply means 11 has a gas supply hole 11a penetrating it along the thickness, and supplies gas to an adhesive layer 3 bonding the substrate 1 and support plate 2 through the gas supply hole 11a. COPYRIGHT: (C)2009,JPO&INPIT
|
