| 摘要 |
PROBLEM TO BE SOLVED: To reduce pits formed on a substrate constituting part of a liquid crystal device, for example. SOLUTION: The thickness of a counter substrate 20 is reduced by etching the counter substrate 20 from the side not near a TFT array substrate 10 in the counter substrate 20 after adhering the counter substrate 20 onto the TFT array substrate 10. Here, the pits P2 due to a defect, such as a flaw which exists on the counter substrate 20 originally similarly to an etching side E1 are formed on an etching side E2 formed by etching the counter substrate 20. Next, the etching side E1 is made flat by embedding resin R1 into the pits P1 existing on the etching side E1. The resin R1 is an ultraviolet curing or thermosetting resin, for example, and curing is performed in the later process. COPYRIGHT: (C)2009,JPO&INPIT
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