| 摘要 |
PROBLEM TO BE SOLVED: To provide a magnetron sputtering apparatus which equalizes erosion of a target. SOLUTION: In the magnetron sputtering apparatus, a substrate and the target are confronted each other in a reaction chamber, a magnetic field generating means is movably arranged at a rear face side of a backing plate to form a magnetic field to the target, a high voltage is applied between the substrate and the target to generate discharge, and a thin film is formed by depositing a constituent atom of a target material onto the substrate. The magnetic field generating means driven and operated along a rear face of the backing plate is constituted by a first permanent magnet 21A and a second permanent magnet 21B which are arranged so that directions of magnetic poles may be reverse in polarity, and a magnetization direction may face toward the rear face of the backing plate. Moreover, thicknesses of the permanent magnets which form magnetic fields in a direction intersecting a drive direction of the magnetic field generating means are made thinner than those of permanent magnets which form magnetic fields along the drive direction, by which magnetic field strength of the first permanent magnet and the second permanent magnet is set to be partially weak. COPYRIGHT: (C)2009,JPO&INPIT
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