Verfahren zur Herstellung eines Chipkartenmoduls und Chipkartenmodul

摘要

Chip card module manufacturing involves providing (200) a paper carrier with two sides. A structured starter layer with conductive particles is applied (210) on one side of the carrier, such that the particles are fixed on the carrier. The structured starter layer is metalized (220) such that a structured metal layer is formed. A chip is mounted (230) on the carrier with another metal layer.