| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a new solder and its production method, an electronic device using the solder, and to provide a method of manufacturing the same. <P>SOLUTION: Solder foil of materials containing metal particles such as Cu and solder particles of Sn extended by applying pressure and an electronic device connected using the solder foil are provided. <P>COPYRIGHT: (C)2009,JPO&INPIT |
