| 摘要 |
PROBLEM TO BE SOLVED: To more securely measure the actual temperature of an element inside a device package by using the actual device for temperature measurement and using the temperature characteristics such as a forward voltage, a wavelength, and an optical output of the device. SOLUTION: The temperature measurement device measures the temperature of the device package, in a soldering step of the device package including therein a semiconductor element having diode characteristics, wherein a semiconductor element the same as the semiconductor element included in the device package is separately prepared for the temperature measurement. The temperature measurement device includes a constant current power supply part 11 for supplying a forward current to the semiconductor element 19 for the temperature measurement and a voltage measurement part 12 for measuring a forward voltage of the semiconductor element 19 for the temperature measurement, and measures the temperature of the device package during the soldering process on the basis of the element temperature obtained by the temperature characteristics of the measured forward voltage. COPYRIGHT: (C)2009,JPO&INPIT |
