| 摘要 |
PROBLEM TO BE SOLVED: To provide a bonding structure capable of maintaining bonding strength even when the recessed part depth of a ceramics member to which a connection member is to be inserted is shallow, and to provide a manufacturing method thereof. SOLUTION: The bonding structure 1 includes: the ceramics member 4 in which a planar internal electrode 2 is embedded and for which a recessed part 4a from the surface to the internal electrode 2 is provided, a terminal hole 4c reaching the internal electrode 2 is provided on a part of the bottom surface 4s of the recessed part 4a, the bottom surface 4s is roughened, and alumina is a main component; a conductive terminal 3 embedded in the terminal hole 4c such that the lower surface is in contact with the internal electrode and the upper surface 3s is exposed to the horizontal level of the bottom surface 4s of the recessed part 4a; a brazing filler metal bonding layer 6 in contact with the bottom surface 4s of the recessed part 4a including the upper surface 3s; and a conductive connection member 5 whose lower part is inserted to the recessed part 4a so that the lower end face 5e is in contact with the brazing filler metal bonding layer and whose thermal expansion coefficient is in the range of 6.5 to 9.5 ppm/K. COPYRIGHT: (C)2009,JPO&INPIT
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