| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing apparatus and a semiconductor manufacturing method capable of uniformly forming a film on a wafer, of reducing usage of gas, of suppressing generation of dust in a reactor, and of suppressing degradation of a yield. SOLUTION: This semiconductor manufacturing apparatus is provided with: the reactor 11 for introducing a wafer w therein; a gas supply mechanism 13 for supplying a process gas into the reactor 11; a gas exhaust mechanism 14 for exhausting the process gas from the reactor 11; a holder 16 for holding the wafer w in its outer peripheral part; heaters 18a and 18b for heating the wafer w from a lower part; a rotating mechanism 15 for rotating the wafer w; a detachable straightening plate 12 arranged for supplying a gas onto the wafer w; and an openable/closable gate 21 arranged on a side surface of the reactor for carrying the wafer w and the straightening plate 12 into the reactor 11 or from the reactor 11. COPYRIGHT: (C)2009,JPO&INPIT
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