| 摘要 |
An inspection probe apparatus is provided to perform the suitable inspection in the semiconductor chip by arranging probes in the vertical direction in the very narrow pitch spacing. The probe machine(200) comprises the pogo block(220) including the tester head(210), and the pogo pin(221), and the inspection probe apparatus(300) including the head plate(230), and the probe(360) and inspection probe equipment holder(240). The chuck(250) is introduced to the location corresponding to the part performing inspection. The wafer(270) which is the checking object is introduced by the robot arm on the chuck. The inspection probe apparatus(300) comprises the substrate section, and the probe part and the guide member(380). The substrate section is electrically connected to the tester head of the probe machine. The probe part is electrically connected to the substrate part. The guide member is respectively combined with the substrate part and probe part. |
