| 摘要 |
<p>A polyimide-based insulating film composition comprising (a) 100 parts by weight of an organic solvent-soluble polyimidosiloxane obtained from a tetracarboxylic acid component and a diamine component comprising 45 to 90 mole percent of a diaminopolysiloxane represented by the following general formula (1):0.5 to 40 mole percent of a polar group-containing aromatic diamine and 0 to 50 mole percent of an aromatic diamine with plural benzene rings, (b) 2 to 40 parts by weight of a polyvalent isocyanate and (c) an organic solvent. The composition has satisfactory storage stability and printing properties, while its cured films exhibit solvent resistance, with both heat resistance and flex resistance.</p> |
