| 摘要 |
A semiconductor chip bonding device and method are provided to rapidly eject the air of the adhesive to outside by repetitively pressurizing the semiconductor chip on the substrate by using the bonding head. The substrate is absorbed to the stage(110). Adhesive is coated the top of the substrate. The semiconductor chip(C) is absorbed to the bonding head(120). The semiconductor chip is touched by the substrate with the lowering of the bonding head. By using the bonding head conveying unit(130), the bonding head raises as the determined times to remove the air of the adhesive. The semiconductor chip is bonded in the substrate by heating. |
