| 摘要 |
PROBLEM TO BE SOLVED: To provide a metal laminate film adapted to allow forming a CCL which is excellent in thermal stability and dimensional stability and what is more, adapted to allow producing a highly reliable fine circuit. SOLUTION: The method of manufacturing a metal laminate film for a semi-additive process includes: a step of forming a metal layer on one side of a peelable heat-resistant substrate; a step of applying a non-thermoplastic polyimide precursor solution over the metal layer, drying the solution and curing to form a non-thermoplastic polyimide film; and a step of peeling the heat-resistant substrate. In addition, there is disclosed a metal laminate film for a semi-additive process which is produced by the foregoing manufacturing method. COPYRIGHT: (C)2009,JPO&INPIT |
